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From the fluid touching the silicon to the CDU pushing it, to the rear-door HX or immersion tank handling the heat — we supply, integrate, and service the components that make AI density possible.
Engineered, non-conductive fluids in direct contact with electronics — either circulating through cold plates or fully submerging the server. Long service life, low GWP, materials-compatible with modern hardware.
Synthetic or hydrocarbon-based dielectric fluids designed to absorb heat from electronic components without conducting electricity, corroding metals, or degrading polymers and seals. Available as single-phase (stays liquid) or two-phase (boils on contact, condenses overhead).
Single-phase immersion tanks, two-phase immersion systems, and direct-to-chip (DLC) loops where the fluid touches the cold plate surface. Increasingly specified into Tier III/IV builds where water leaks adjacent to GPUs are unacceptable.
Fluid selection is a downstream consequence of tank/CDU selection and OEM compatibility lists — not a free choice. We'll cross-check your hardware vendor's approved fluid list against in-country availability and total cost over a 7-year horizon, including top-up and disposal.
The pumps, heat exchangers, and plumbing that move heat from the chip to the facility loop. Sized 70 kW to 2 MW+, available as in-row, in-rack, and sidecar configurations.
A CDU isolates the clean, low-pressure technology cooling system (TCS) that runs through the GPUs from the dirtier, higher-pressure facility cooling system (FCS) that connects to chillers, dry coolers, or cooling towers. Manifolds distribute that flow across racks.
Direct-to-chip deployments using cold plates on GPU, CPU and memory. Hybrid halls where 70–80% of the heat goes to liquid and the remaining 20–30% stays on residual air. New AI rows and retrofit upgrades inside existing colos.
CDU sizing is the most consequential decision in the whole loop. Undersize and you can't sustain training workloads in summer. Oversize and you've spent capex on capacity that pumps inefficiently at partial load. We size based on real GPU TDP, not nameplate, and always against worst-case ambient for Chennai/Bengaluru/Hyderabad.
Two roads to the same destination — keep the room-level air architecture by capturing heat at the rack door, or skip air entirely by submerging the server in dielectric fluid.
Rear-door HX replace the standard rear door of a rack with a passive or active liquid-to-air heat exchanger. Heat from the servers crosses the coil before it ever reaches the room. Up to ~50 kW per rack, transparent to the IT stack.
Immersion tanks submerge entire servers in dielectric fluid. Single-phase tanks rely on convection plus a small pump and external heat exchanger. Two-phase tanks use boiling fluid and overhead condensers. 100+ kW per tank is routine.
RDHX: ideal for retrofitting existing white space without rebuilding the air containment, supporting medium-high densities (15–50 kW) with minimal disruption. Immersion: greenfield AI halls, edge sites with poor ambient, or operators who want to eliminate air handlers entirely.
The trade-off is rarely thermal — it's operations. Immersion requires a rethink of how techs touch hardware (cranes, drip racks, RMA process). RDHX preserves the operating model but caps you at ~50 kW. We help operators model both paths and pick based on the realities of their site, not a brochure.
— Not sure which lane fits —
Send us GPU model, rack count, and target density. We'll come back with a sized solution across all three lanes — fluid, CDU, and termination.